Integrated circuits incorporating both digital and analog functions have become increasingly prevalent in the semiconductor industry. Mixed-signal IC test and measurement has grown into a highly specialized field of electrical engineering. However, test engineering is still a relatively unknown profession compared to IC design engineering. It has become harder to hire and train new engineers to become skilled mixed-signal test engineers. The slow learning curve for mixed-signal test engineers is largely due to the shortage of written materials and university-level courses on the subject of mixed-signal testing. While many textbooks have been devoted to the subject of digital test and testability, the same cannot be said for analog and mixed-signal automated test and measurement.
An Introduction to Mixed-Signal IC Test and Measurement is a textbook for advanced undergraduate and graduate-level students as well as engineering professionals. It was written in response to the shortage of basic course material for mixed-signal test and measurement. The book assumes a solid background in analog and digital circuits as well as a working knowledge of computers and computer programming. A background in digital signal processing and statistical analysis is also helpful, though not absolutely necessary.
This text encompasses the testing of both analog and mixed-signal circuits including many borderline examples. Digital testing is covered, but not as extensively because of the wealth of information on this topic already available. Examples and illustrations using state-of-the-art industrial technology enrich and enliven the presentation throughout. In considering the applications of this technology, the testing of large-scale mixed-signal circuits and individual circuits is introduced. The value-added benefits of mixed-signal IC testing to a manufacturer's product are clearly discussed, and the role of the test engineer is clearly defined.
Chapter 1: Overview of Mixed-Signal Testing
1.1. Mixed-Signal Ciruits
1.2. Why Test Mixed-Signal Devices
1.3. Post-Silicon Production Flow
1.4. Test and Diagnostic Equipment
1.5. New Product Development
1.6. Mixed-Signal Testing Challenges
Chapter 2: The Test Specification Process
2.1. Device Data Sheets
2.2. Generating the Test Plan
2.3. Components of a Test Program
2.4. Summary
Chapter 3: DC and Parametric Measurements
3.1. Continuity
3.2. Leakage Currents
3.3. Power Supply Currents
3.4. DC References and Regulators
3.5. Impedance Measurements
3.6. DC Offset Measurements
3.7. DC Gain Measurements
3.8. DC Power Supply Rejection Ratio
3.9. DC Common Mode Rejection Ratio
3.10. Comparator DC Tests
3.11. Voltage Search Techniques
3.12. DC Tests for Digital Circuits
3.13. Summary
Chapter 4: Measurement Accuracy
4.1. Terminology
4.2. Calibrations and Checkers
4.3. Dealing with Measurement Error
4.4. Basic Data Analysis
4.5. Summary
Chapter 5: Tester Hardware
5.1. Mixed-Signal Tester Overview
5.2. DC Resources
5.3. Digital Subsystem
5.4. AC Source and Measurement
5.5. Time Measurement System
5.6. Computing Hardware
5.7. Summary
Chapter 6: Sampling Theory
6.1. Analog Measurements Using DSP
6.2. Sampling and Reconstruction
6.3. Repetitive Sample Sets
6.4. Synchronization of Sampling Systems
6.5. Summary
Chapter 7: DSP-Based Testing
7.1. Advantages of DSP-Based Testing
7.2. Digital Signal Processing
7.3. Discrete-Time Transforms
7.4. The Inverse FFT
7.5. Summary
Chapter 8: Analog Channel Testing
8.1. Overview
8.2. Gain and Level Tests
8.3. Phase Tests
8.4. Distortion Tests
8.5. Signal Rejection Tests
8.6. Noise Tests
8.7. Simulation of Analog Channel Tests
8.8. Summary
Chapter 9: Sampled Channel Testing
9.1. Overview
9.2. Sampling Considerations
9.3. Encoding and Decoding
9.4. Sampled Channel Tests
9.5. Summary
Chapter 10: Focused Calibrations
10.1. Overview
10.2. DC Calibrations
10.3. AC Amplitude Calibrations
10.4. Other AC Calibrations
10.5. Error Cancellation Techniques
10.6. Summary
Chapter 11: DAC Testing
11.1. Basics of Converter Testing
11.2. Basic DC Tests
11.3. Transfer Curve Tests
11.4. Dynamic DAC Tests
11.5. DAC Architectures
11.6. Summary
Chapter 12: ADC Testing
12.1. ADC Testing Versus DAC Testing
12.2. ADC Code Edge Measurements
12.3. DC Tests and Transfer Curve Tests
12.4. Dynamic ADC Tests
12.5. ADC Architectures
12.6. Tests for Common ADC Applications
12.7. Summary
Chapter 13: DIB Design
13.1. DIB Basics
13.2. Printed Circuit Boards (PCBS)
13.3. DIB Traces, Shields, and Guards
13.4. Transmission Lines
13.5. Grounding and Power Distribution
13.6. DIB Components
13.7. Common DIB Circuits
13.8. Common DIB Mistakes
13.9. Summary
Chapter 14: Design for Test (DfT)
14.1. Overview
14.2. Advantages of DfT
14.3. Digital Scan
14.4. Digital BIST
14.5. Digital DfT for Mixed-Signal Circuits
14.6. Mixed-Signal Boundary Scan and BIST
14.7. Ad Hoc Mixed-Signal DfT
14.8. Subtle Forms of Analog DFT
14.9. IDDQ
14.10. Summary
Chapter 15: Data Analysis
15.1. Introduction to Data Analysis
15.2. Data Visualization Tools
15.3. Statistical Analysis
15.4. Statistical Process Control (SPC)
15.5. Summary
Chapter 16: Test Economics
16.1. Profitability Factors
16.2. Direct Testing Costs
16.3. Debugging Skills
16.4. Emerging Trends
16.5. Summary
Mark Burns, Gordon W. RobertsProfessor in the Department of Electrical and Computer Engineering, McGill University